Simon Glass <sjg@chromium.org> says:
When the SPL build-phase was first created it was designed to solve a
particular problem (the need to init SDRAM so that U-Boot proper could
be loaded). It has since expanded to become an important part of U-Boot,
with three phases now present: TPL, VPL and SPL
Due to this history, the term 'SPL' is used to mean both a particular
phase (the one before U-Boot proper) and all the non-proper phases.
This has become confusing.
For a similar reason CONFIG_SPL_BUILD is set to 'y' for all 'SPL'
phases, not just SPL. So code which can only be compiled for actual SPL,
for example, must use something like this:
#if defined(CONFIG_SPL_BUILD) && !defined(CONFIG_TPL_BUILD)
In Makefiles we have similar issues. SPL_ has been used as a variable
which expands to either SPL_ or nothing, to chose between options like
CONFIG_BLK and CONFIG_SPL_BLK. When TPL appeared, a new SPL_TPL variable
was created which expanded to 'SPL_', 'TPL_' or nothing. Later it was
updated to support 'VPL_' as well.
This series starts a change in terminology and usage to resolve the
above issues:
- The word 'xPL' is used instead of 'SPL' to mean a non-proper build
- A new CONFIG_XPL_BUILD define indicates that the current build is an
'xPL' build
- The existing CONFIG_SPL_BUILD is changed to mean SPL; it is not now
defined for TPL and VPL phases
- The existing SPL_ Makefile variable is renamed to SPL_
- The existing SPL_TPL Makefile variable is renamed to PHASE_
It should be noted that xpl_phase() can generally be used instead of
the above CONFIGs without a code-space or run-time penalty.
This series does not attempt to convert all of U-Boot to use this new
terminology but it makes a start. In particular, renaming spl.h and
common/spl seems like a bridge too far at this point.
The series is fully bisectable. It has also been checked to ensure there
are no code-size changes on any commit.
Use PHASE_ as the symbol to select a particular XPL build. This means
that SPL_TPL_ is no-longer set.
Update the comment in bootstage to refer to this symbol, instead of
SPL_
Signed-off-by: Simon Glass <sjg@chromium.org>
S28HS02GT is dual-die package parts and do not support chip erase.
Fixes: 16dd109510 ("mtd: spi-nor-ids: Add Infineon(Cypress) s28hs02gt ID")
Reviewed-by: Tudor Ambarus <tudor.ambarus@linaro.org>
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
S25HL02GT and S25HS02GT are dual-die package parts and do not support
chip erase.
Fixes: c95a914aed ("mtd: spi-nor-ids: Add Cypress s25hl-t/s25hs-t")
Reviewed-by: Tudor Ambarus <tudor.ambarus@linaro.org>
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
The S25FS064S, S25FS128S, and S25FS256S are the same family of SPI NOR
Flash devices with S25FS512S. Some difference depending on the device
densities are taken care in post SFDP fixup.
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Pratyush Yadav <pratyush@kernel.org>
The correct 4KB erase opcode should be selected based on the address width
currently used.
Fixes: 562d166a13 ("mtd: spi-nor-core: Add fixups for s25fs512s")
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Pratyush Yadav <pratyush@kernel.org>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
The mx25u25635f entry exists twice in spi_nor_ids, remove the less
complete variant of the entry and keep only one copy of it.
Fixes: f0084f1dfd ("drivers/mtd/spi/spi-nor-ids.c: add mx25u25635f support")
Signed-off-by: Marek Vasut <marex@denx.de>
Reviewed-by: Michal Simek <michal.simek@amd.com>
Reviewed-by: Tudor Ambarus <tudor.ambarus@linaro.org>
The w25q16dw entry exists twice in spi_nor_ids, remove the less
complete variant of the entry and keep only one copy of it.
Fixes: baef13ec9d ("mtd: spi-nor-ids: Add support for flashes tested by xilinx")
Signed-off-by: Marek Vasut <marex@denx.de>
Reviewed-by: Michal Simek <michal.simek@amd.com>
Reviewed-by: Tudor Ambarus <tudor.ambarus@linaro.org>
Some Winbond SPI NORs have special SR3 register which is
used among other things to control whether non-standard
"Individual Block/Sector Write Protection" (WPS bit)
locking scheme is activated. This non-standard locking
scheme is not supported by either U-Boot or Linux SPI
NOR stack so make sure it is disabled, otherwise the
SPI NOR may appear locked for no obvious reason.
This SR3 WPS appears e.g. on W25Q16FW which has the same ID as
W25Q16DW, but the W25Q16DW does not implement the SR3 WPS bit.
Signed-off-by: Marek Vasut <marex@denx.de>
Read chipselect properties from DT which are populated using 'reg'
property and save it in plat->cs[] array for later use.
Also read multi chipselect capability which is used for
parallel-memories and return errors if they are passed on using DT but
driver is not capable of handling it.
Signed-off-by: Ashok Reddy Soma <ashok.reddy.soma@amd.com>
Signed-off-by: Venkatesh Yadav Abbarapu <venkatesh.abbarapu@amd.com>
Add support for parallel memories and stacked memories configuration
in read_bar and write_bar functions.
Signed-off-by: Ashok Reddy Soma <ashok.reddy.soma@amd.com>
Signed-off-by: Venkatesh Yadav Abbarapu <venkatesh.abbarapu@amd.com>
Add support for parallel memories flash configuration in read status
register and read flag status register functions.
Signed-off-by: Ashok Reddy Soma <ashok.reddy.soma@amd.com>
Signed-off-by: Venkatesh Yadav Abbarapu <venkatesh.abbarapu@amd.com>
In parallel mode, the current implementation assumes that a maximum of
two flashes are connected. The QSPI controller splits the data evenly
between both the flashes so, both the flashes that are connected in
parallel mode should be identical.
During each operation SPI-NOR sets 0th bit for CS0 & 1st bit for CS1 in
nor->flags.
In stacked mode the current implementation assumes that a maximum of two
flashes are connected and both the flashes are of same make but can
differ in sizes. So, except the sizes all other flash parameters of both
the flashes are identical
Spi-nor will pass on the appropriate flash select flag to low level
driver, and it will select pass all the data to that particular flash.
Write operation in parallel mode are performed in page size * 2 chunks as
each write operation results in writing both the flashes. For doubling
the address space each operation is performed at addr/2 flash offset,
where addr is the address specified by the user.
Similarly for read and erase operations it will read from both flashes,
so size and offset are divided by 2 and send to flash.
Adding the config option SPI_ADVANCE for non SPL code.
Signed-off-by: Ashok Reddy Soma <ashok.reddy.soma@amd.com>
Signed-off-by: Venkatesh Yadav Abbarapu <venkatesh.abbarapu@amd.com>
This patch fixes timeout issues seen on large NOR flash.
For full-chip erase, where we use the SPINOR_OP_CHIP_ERASE (0xc7)
opcode. Use a different timeout for full-chip erase than for other
commands.
[Ported from Linux kernel commit
09b6a377687b ("mtd: spi-nor: scale up timeout for
full-chip erase") ]
Signed-off-by: Venkatesh Yadav Abbarapu <venkatesh.abbarapu@amd.com>
On DTR capable flashes like Micron Xcella the writes cannot start or end
at an odd address in DTR mode. Extra 0xff bytes need to be prepended or
appended respectively to make sure both the start and end addresses are
even.
Signed-off-by: Pratyush Yadav <p.yadav@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Tested-by: Jonathan Humphreys <j-humphreys@ti.com>
Signed-off-by: Manorit Chawdhry <m-chawdhry@ti.com>
As part of bringing the master branch back in to next, we need to allow
for all of these changes to exist here.
Reported-by: Jonas Karlman <jonas@kwiboo.se>
Signed-off-by: Tom Rini <trini@konsulko.com>
When bringing in the series 'arm: dts: am62-beagleplay: Fix Beagleplay
Ethernet"' I failed to notice that b4 noticed it was based on next and
so took that as the base commit and merged that part of next to master.
This reverts commit c8ffd1356d, reversing
changes made to 2ee6f3a5f7.
Reported-by: Jonas Karlman <jonas@kwiboo.se>
Signed-off-by: Tom Rini <trini@konsulko.com>
Remove <common.h> from this driver directory and when needed
add missing include files directly.
Reviewed-by: William Zhang <william.zhang@broadcom.com>
Signed-off-by: Tom Rini <trini@konsulko.com>
Some of Kconfigs are using utf-8 encoding because of used chars. Convert
all of them to ascii enconging. Based on discussion ASCII should be used in
general with the exception of names.
Signed-off-by: Michal Simek <michal.simek@amd.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
Infineon(Cypress) S28HS02GT is 1.8V, 2Gb (256MB) NOR Flash memory with
Octal interface. It is a dual-die package parts and has same features
with existing S28 series.
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Dhruva Gole <d-gole@ti.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
Enabling Octal DTR mode in multi-die package parts requires reister setup
for each die. That can be done by simple for-loop. write_enable() takes
effect to all die at once so we can call it before the loop. Besides we
can replace spi_mem_exec_op() calls with spansion_read/write_any_reg().
And finally, we must mask CFR2V[7:4] when changing dummy cycles, as
CFR2V[7] indicates current addressing mode and that should be 1 (4-byte
address mode) for multi-die package parts.
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
s28hx_t_post_bfpt_fixup() fixes erase opcode, erase size, and page size.
s25_post_bfpt_fixup() is doing same thing including multi-die support.
We can consolidate s28hx_t_post_bfpt_fixup() and s25_post_bfpt_fixup()
into one named s25_s28_post_bfpt_fixup().
In s25_s28_post_bfpt_fixup(), set_4byte() is called to force the device to
be 4-byte addressing mode. In S28HS02GT datasheet, the B7 opcode is missing
but it works actually (confirmed).
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
s28hx_t_setup() only checks sector layout setting. To support multi-die
package parts like S28HS02GT, it needs to check device size and assign
ready() hook for multi-die package parts. These are covered in s25_setup()
so we can consolidate s28hx_t_setup() and s25_setup() into one named
s25_s28_setup().
spi_nor_wait_till_ready() at the beginning of s28hx_t_setup() can be
removed since there is no op that makes device busy state before setup.
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
s25_mdp_ready() handles status polling for multi-die package parts that
requires to read and check status register for each die. To support
S28HS02GT(dual-die package with Octal DTR support), rename function and
use nor->rdsr_dummy in octal DTR mode.
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
Infineon(Cypress) S28Hx-T family does not support legacy CLSR(0x30) opcode.
Instead, it supports CLPEF(0x82) which has the same functionality as CLSR.
spansion_sr_ready() is for multi-die package parts including S28HS02GT, so
we need to use CLPEF instead of CLSR.
This change does not affect to S25x02GT which uses spansion_sr_ready() as
S25Hx-T family also supports CLPEF(0x82) as well as CLSR(0x30).
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
In Infineon multi-die package parts, we need to use Read Any Register op
to read status register in 2nd or further die. Infineon S28HS02GT is
dual-die package and supports Octal DTR interface. To support this,
spansion_read_any_reg() needs to be reworked. Implementation is similar
to existing read_sr() that already supports Octal DTR mode.
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
s25_erase_non_uniform() and s28hx_t_erase_uniform() support hybrid sector
layout (32 x 4KB sectors overlaid at bottom address) and doing same thing.
Consolidate them into single helper named s25_s28_erase_non_uniform().
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
Some macro definitions used in Infineon(Cypress) S25 and S28 series are
redundant and some have inconsistent prefix. This patch removes
redundant ones and renames some to have same prefix as others.
Signed-off-by: Takahiro Kuwano <Takahiro.Kuwano@infineon.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
Added support for the ISSI OSPI flash part IS25LX512M.
Initial testing was performed on the Tenzing-se1 board using
SDR mode, covering basic erase, write, and readback operations.
Signed-off-by: Tejas Bhumkar <tejas.arvind.bhumkar@amd.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
During SFDP header parse and BFPT parse, structures in stack are used
to perform spi_nor_read_sfdp() which expects a dma-safe buffer.
This commit introduces spi_nor_read_sfdp_dma_unsafe() to wrap
spi_nor_read_sfdp() using a kmalloc'ed bounce buffer which is
the same implementation in Linux (drivers/mtd/spi-nor/sfdp.c).
Signed-off-by: Vaishnav Achath <vaishnav.a@ti.com>
Reviewed-by: Pratyush Yadav <p.yadav@ti.com>
Reviewed-by: Jagan Teki <jagan@amarulasolutions.com>
MT25QU01 OPN with 4B OPCODE support is currently not supported in
source code and the driver reuses the definition for "n25q00a"
which has the same silicon ID but is a slower part.
Adding mt25u01g definition to the source code to support a faster
read response for MT25QU01 QSPI NOR Flash device.
Signed-off-by: Jit Loon Lim <jit.loon.lim@intel.com>
[jagan: fix the id position and commit head]
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Add support for the zBIT ZB25VQ128 (128M-bit) SPI NOR flash memory chip,
as used on the Xunlong Orange Pi Zero 3 board.
Signed-off-by: Andre Przywara <andre.przywara@arm.com>
Reviewed-by: Dragan Simic <dsimic@manjaro.org>
